Dr. Barry R. Lieberman
SPIE Involvement:
Author | Instructor
Publications (8)

Proceedings Article | 29 May 2007 Paper
Proc. SPIE. 6607, Photomask and Next-Generation Lithography Mask Technology XIV
KEYWORDS: Multilayers, Metrology, Etching, Inspection, Reflectivity, Photomasks, Extreme ultraviolet, Extreme ultraviolet lithography, Mask making, Defect inspection

Proceedings Article | 5 April 2007 Paper
Proc. SPIE. 6518, Metrology, Inspection, and Process Control for Microlithography XXI
KEYWORDS: Metrology, Polarization, Imaging systems, Etching, Scanners, Near field, Photomasks, Phase measurement, Semiconducting wafers, Phase shifts

Proceedings Article | 15 March 2007 Paper
Proc. SPIE. 6517, Emerging Lithographic Technologies XI
KEYWORDS: Lithography, Reticles, Metrology, Interferometers, Error analysis, 3D modeling, Photomasks, Extreme ultraviolet, Extreme ultraviolet lithography, Semiconducting wafers

Proceedings Article | 8 November 2005 Paper
Proc. SPIE. 5992, 25th Annual BACUS Symposium on Photomask Technology
KEYWORDS: Diffractive optical elements, Optical properties, Argon, Sputter deposition, Particles, Inspection, Reflectivity, Surface roughness, Photomasks, Extreme ultraviolet

Proceedings Article | 6 December 2004 Paper
Proc. SPIE. 5567, 24th Annual BACUS Symposium on Photomask Technology
KEYWORDS: Lithography, Databases, Image processing, Inspection, Computer simulations, Data archive systems, Photomasks, Critical dimension metrology, Semiconducting wafers, Defect inspection

Showing 5 of 8 publications
Course Instructor
SC617: Advanced Topics in Electron Beam Lithography
This course covers advanced concepts in the patterning of photomasks or wafers by electron beam lithography. The course focuses on understanding the fundamental electron-material interaction mechanisms that form the basis of the exposure process and then proceeds to discuss the post-exposure process. This course is complementary to other courses that emphasize electron beam lithography instrumentation and writing techniques. The course is divided into six main topics: introductory material, basic electron-material interactions, applications to photomask exposure, electron proximity correction, use of simulation techniques to model the exposure process, and post exposure processing.
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