Dr. Benjamin L. Clark
at Inpria Corp
SPIE Involvement:
Author
Publications (6)

Proceedings Article | 25 March 2016
Proc. SPIE. 9779, Advances in Patterning Materials and Processes XXXIII
KEYWORDS: Oxides, Optical lithography, Etching, Metals, Photons, Photoresist materials, Line width roughness, Absorbance, Extreme ultraviolet lithography, Chemical elements, Photoresist processing, Stochastic processes

Proceedings Article | 18 March 2016
Proc. SPIE. 9776, Extreme Ultraviolet (EUV) Lithography VII
KEYWORDS: Lithography, Optical lithography, Etching, Metals, Resistance, Photoresist materials, Photomasks, Extreme ultraviolet, Extreme ultraviolet lithography, Photoresist processing, Semiconducting wafers, System on a chip, Back end of line

Proceedings Article | 20 March 2015
Proc. SPIE. 9425, Advances in Patterning Materials and Processes XXXII
KEYWORDS: Oxides, Etching, Metals, Photoresist materials, Extreme ultraviolet, Line width roughness, Absorbance, Extreme ultraviolet lithography, System on a chip, Tin

Proceedings Article | 20 March 2015
Proc. SPIE. 9425, Advances in Patterning Materials and Processes XXXII
KEYWORDS: Oxides, Contamination, Etching, Metals, Photoresist materials, Extreme ultraviolet lithography, Thin film coatings, Semiconducting wafers, Photoresist developing, Tin

Proceedings Article | 23 March 2012
Proc. SPIE. 8322, Extreme Ultraviolet (EUV) Lithography III
KEYWORDS: Lithography, Polymers, Coating, Photoresist materials, Extreme ultraviolet, Extreme ultraviolet lithography, Thin film coatings, Photoresist processing, Semiconducting wafers, Polymer thin films

Proceedings Article | 7 April 2011
Proc. SPIE. 7969, Extreme Ultraviolet (EUV) Lithography II
KEYWORDS: Oxides, Etching, Metals, Photons, Coating, Extreme ultraviolet, Extreme ultraviolet lithography, Photoresist processing, Semiconducting wafers, Absorption

Showing 5 of 6 publications
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