Dr. Bo Huang
at Changchun Univ of Science and Technology
SPIE Involvement:
Author
Publications (1)

PROCEEDINGS ARTICLE | January 7, 2008
Proc. SPIE. 6824, Semiconductor Lasers and Applications III
KEYWORDS: Packaging, Gold, High power lasers, Copper, Resistance, Laser welding, Semiconductor lasers, Aluminum nitride, Electroplating, Tin

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