Boo-Hyun Ham
Senior Engineer at SAMSUNG Electronics Co Ltd
SPIE Involvement:
Author
Publications (4)

PROCEEDINGS ARTICLE | March 28, 2017
Proc. SPIE. 10145, Metrology, Inspection, and Process Control for Microlithography XXXI
KEYWORDS: Electron beam lithography, Metrology, Defect detection, Metals, Scanners, Inspection, Scanning electron microscopy, Photomasks, Critical dimension metrology, Semiconducting wafers

PROCEEDINGS ARTICLE | April 6, 2012
Proc. SPIE. 8324, Metrology, Inspection, and Process Control for Microlithography XXVI
KEYWORDS: Wafer-level optics, Oxides, Detection and tracking algorithms, Error analysis, Silicon, Reflectivity, Precision measurement, Semiconducting wafers, Wafer testing, Overlay metrology

PROCEEDINGS ARTICLE | April 4, 2012
Proc. SPIE. 8324, Metrology, Inspection, and Process Control for Microlithography XXVI
KEYWORDS: Metrology, Data modeling, Scanners, Error analysis, Nondestructive evaluation, Photomasks, Semiconducting wafers, Overlay metrology, Back end of line, Front end of line

PROCEEDINGS ARTICLE | April 2, 2010
Proc. SPIE. 7638, Metrology, Inspection, and Process Control for Microlithography XXIV
KEYWORDS: Oxides, Lithography, Diffraction, Metrology, Image processing, Scatterometry, Photoresist processing, Semiconducting wafers, Overlay metrology, Diffraction gratings

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