Mr. Boxiu Cai Profile

Boxiu Cai

Application Engineer at ASML Hillsboro

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Publications (3)

Proceedings Article | 31 March 2014 Paper

Study on abnormal intra-field CD uniformity induced by Efese-tilt application upon complex leveling scheme

Guogui Deng, Jingan Hao, Boxiu Cai, Bin Xing, Xin Yao, Qiang Zhang, Tianhui Li, Yi-Shih Lin, Qiang Wu, Xuelong Shi

Proceedings Volume 9052, 905229 (2014) https://doi.org/10.1117/12.2046308

KEYWORDS: Semiconducting wafers, Critical dimension metrology, Chlorine, Photomasks, Laser sources, Safety, Image processing, Fermium, Frequency modulation, Semiconductor manufacturing

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Proceedings Article | 10 April 2013 Paper

Characterization of a 'first measurement effect' in CD-SEM measurement

Boxiu Cai, Siyuan Yang, Yi-Shih Lin, Yi Huang, Wen-Hui Li, Qiang Wu, Michael Hao

Proceedings Volume 8681, 868131 (2013) https://doi.org/10.1117/12.2010942

KEYWORDS: Scanning electron microscopy, Critical dimension metrology, Metrology, Line edge roughness, Physics, Time metrology, Semiconducting wafers, Control systems, Semiconductors, Image acquisition

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Proceedings Article | 10 April 2013 Paper

Quantitative CD-SEM resist shrinkage study and its application for accurate CD-SEM tools' matching

Wen Hui Li, Yi Shih Lin, Siyuan Frank Yang, Bo Xiu Cai, Yi Huang

Proceedings Volume 8681, 868128 (2013) https://doi.org/10.1117/12.2011244

KEYWORDS: Data modeling, Critical dimension metrology, Semiconducting wafers, Metrology, Error analysis, Americium, Process control, Statistical analysis, Manufacturing, Signal detection

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