Dr. Boyao Zhang Profile

Dr. Boyao Zhang

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Publications (2)

Proceedings Article | 10 April 2024 Poster

High throughput, angstrom-level metrology for copper-copper hybrid bonding

Arseniy Kalinin, Niranjan Saikumar, Irene Battisti, Erik Simons, Seokhan Kim, ShihWei Yu, Hokyun Chin, Artem Khachaturiants, Cong Chen, Bensu Tunca Altintas, Soon Aik Chew, Boyao Zhang, Nelda Antonovaité, Rudolf Wilhelm, Alain Moussa, Janusz Bogdanowicz, Anne-Laure Charley, Hamed Sadeghian

Proceedings Volume 12955, 129552T (2024) https://doi.org/10.1117/12.3010482

KEYWORDS: Metrology, Semiconducting wafers, Copper, Chemical mechanical planarization, Surface roughness, High volume manufacturing, Atomic force microscopy, Wafer bonding, Wafer testing, System integration

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Proceedings Article | 10 April 2024 Presentation + Paper

Cu pad surface height evaluation technique by in-line SEM for wafer hybrid bonding

Hiroaki Kasai, Mayuka Osaki, Kazuhisa Hasumi, Nobuyuki Mise, Maki Tanaka, Bensu Tunca Altintas, Soon Aik Chew, Janusz Bogdanowicz, Alain Moussa, Mohamed Saib, Boyao Zhang, Anne-Laure Charley

Proceedings Volume 12955, 129551N (2024) https://doi.org/10.1117/12.3008658

KEYWORDS: Copper, Semiconducting wafers, Scanning electron microscopy, Wafer bonding, Sensors, Atomic force microscopy, Signal detection, Image sensors, Chemical mechanical planarization, Target detection

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