Brian W. Kidd
Sr. Applications Engineer at Integrated Designs LP
SPIE Involvement:
Author
Publications (5)

PROCEEDINGS ARTICLE | April 3, 2008
Proc. SPIE. 6923, Advances in Resist Materials and Processing Technology XXV
KEYWORDS: Patents, Image segmentation, Manufacturing, 3D modeling, Photoresist materials, Head, Thin film coatings, Semiconducting wafers, Tolerancing

PROCEEDINGS ARTICLE | March 26, 2008
Proc. SPIE. 6923, Advances in Resist Materials and Processing Technology XXV
KEYWORDS: Optical lithography, Deep ultraviolet, Error analysis, Silicon, Control systems, Telecommunications, Data communications, Photoresist processing, Semiconducting wafers, Signal detection

PROCEEDINGS ARTICLE | March 29, 2006
Proc. SPIE. 6153, Advances in Resist Technology and Processing XXIII
KEYWORDS: Deep ultraviolet, Particles, Error analysis, Silicon, Manufacturing, Control systems, Photoresist materials, Telecommunications, Data communications, Semiconducting wafers

PROCEEDINGS ARTICLE | May 14, 2004
Proc. SPIE. 5376, Advances in Resist Technology and Processing XXI
KEYWORDS: Optical lithography, Diffractive optical elements, Etching, Coating, Manufacturing, Photoresist materials, Reactive ion etching, Thin film coatings, Semiconducting wafers, Bottom antireflective coatings

PROCEEDINGS ARTICLE | June 12, 2003
Proc. SPIE. 5039, Advances in Resist Technology and Processing XX
KEYWORDS: Diffractive optical elements, Sensors, Digital filtering, Particles, Coating, Chemistry, Manufacturing, Thin film coatings, Semiconducting wafers, Bottom antireflective coatings

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