Byungki Woo
at Univ of Texas at Austin
SPIE Involvement:
Author
Publications (1)

Proceedings Article | 20 March 2006 Paper
Proceedings Volume 6176, 61761H (2006) https://doi.org/10.1117/12.658952
KEYWORDS: Sensors, Nondestructive evaluation, Copper, Metals, Cements, Inductive coupling, Inductance, Corrosion, Printed circuit board testing, Dielectrics

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