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Dr. Choongman Lee
at Tokyo Electron Technology Solutions
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Publications (1)
Proceedings Article | 9 April 2018 Paper
Line roughness improvements on self-aligned quadruple patterning by wafer stress engineering
Eric Liu, Akiteru Ko, Peter Biolsi, Soo Doo Chae, Chia-Yun Hsieh, Munehito Kagaya, Choongman Lee, Tsuyoshi Moriya, Shimpei Tsujikawa, Yusuke Suzuki, Kazuya Okubo, Kiyotaka Imai
Proceedings Volume 10589, 105890T (2018) https://doi.org/10.1117/12.2299618
KEYWORDS: Etching, Optical lithography, Semiconducting wafers, Line width roughness, Line edge roughness, Photomasks, Silicon, Plasma etching, Atomic layer deposition, Inspection
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