Dr. Chung-en Zah
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SPIE Involvement:
Conference Program Committee | Symposium Chair | Symposium Committee | Conference Chair | Author
Publications (35)

Proceedings Article | 4 March 2019
Proc. SPIE. 10900, High-Power Diode Laser Technology XVII
KEYWORDS: Packaging, High power lasers, Semiconductor lasers, Near field, Diodes, Laser bonding

Proceedings Article | 4 March 2019
Proc. SPIE. 10899, Components and Packaging for Laser Systems V
KEYWORDS: Quantum wells, Diffusion, Resistance, 3D modeling, Semiconductor lasers, Finite element methods, Analytical research, High power diode lasers, Heat flux, Thermal modeling

Proceedings Article | 4 March 2019
Proc. SPIE. 10899, Components and Packaging for Laser Systems V
KEYWORDS: Packaging, High power lasers, Copper, Dielectrics, Gallium arsenide, Laser development, Semiconductor lasers, Optical simulations, Structural design, Optical isolators

Proceedings Article | 6 November 2018
Proc. SPIE. 10812, Semiconductor Lasers and Applications VIII
KEYWORDS: Computational fluid dynamics, High power lasers, Resistance, 3D modeling, Semiconductor lasers, Solids, Thermal effects, Heatsinks

Proceedings Article | 5 November 2018
Proc. SPIE. 10811, High-Power Lasers and Applications IX
KEYWORDS: Packaging, High power lasers, Indium, Reliability, Laser welding, Solid state lasers, Semiconductor lasers, Diodes, Optical simulations, Laser bonding

SPIE Journal Paper | 24 March 2018
OE Vol. 57 Issue 03
KEYWORDS: Near field, Laser bonding, Packaging, Semiconductor lasers, Copper, Optical simulations, High power lasers, Diodes, Near field optics, Optical engineering

Showing 5 of 35 publications
Conference Committee Involvement (8)
Components and Packaging for Laser Systems VI
1 February 2020 | San Francisco, California, United States
Components and Packaging for Laser Systems V
4 February 2019 | San Francisco, California, United States
Components and Packaging for Laser Systems IV
30 January 2018 | San Francisco, California, United States
Components and Packaging for Laser Systems III
31 January 2017 | San Francisco, California, United States
Asia-Pacific Optical Communications
1 November 2007 | Wuhan, China
Showing 5 of 8 published special sections
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