Dr. Damien Carau
PhD / Engineer at ESRF - The European Synchrotron
SPIE Involvement:
Author
Area of Expertise:
Optical Metrology , X-Ray Optics , Scatterometry , Semiconductor Physics , Microelectronics , CD & Overlay Metrology
Profile Summary

Engineer in Physics, Electronics and Materials, then PhD in Nanotechnologies, I have a significant background in optics and metrology. Currently working for the European Synchrotron (ESRF) in the X-Ray Optics Group, I am involved in the characterization of multilayer mirrors (thickness and roughness measurements).
Previously, I have been working as a PhD student and a junior engineer at STMicroelectronics for 3 years. I was in charge of the optimization of the scatterometry technique for advanced CMOS node lithography, and more precisely for double patterning lithography. I implemented a specific methodology to gain in sensitivity and accuracy in critical dimension and overlay measurements. I developed a Matlab code to simulate the sensitivity of diffraction-based overlay and scatterometry targets. I have confronted simulation results to experimental data acquired on wafers in clean room environment.
I am interested in acting in ambitious projects combining physics and engineering. Project management would be an extra motivation.
Publications (5)

PROCEEDINGS ARTICLE | August 23, 2017
Proc. SPIE. 10386, Advances in X-Ray/EUV Optics and Components XII
KEYWORDS: Multilayers, Light sources, X-ray optics, Sputter deposition, Crystals, X-rays, Coating, Reflectivity, Monochromators

PROCEEDINGS ARTICLE | August 23, 2017
Proc. SPIE. 10386, Advances in X-Ray/EUV Optics and Components XII
KEYWORDS: Multilayers, X-ray optics, X-rays, Optical coatings, Reflectivity, Optical metrology, Reflectometry, Optical simulations, Synchrotron radiation, Optimization (mathematics)

PROCEEDINGS ARTICLE | April 10, 2015
Proc. SPIE. 9424, Metrology, Inspection, and Process Control for Microlithography XXIX
KEYWORDS: Lithography, Diffraction, Metrology, Optical lithography, Etching, Image processing, Process control, Double patterning technology, Critical dimension metrology, Overlay metrology

PROCEEDINGS ARTICLE | March 19, 2015
Proc. SPIE. 9424, Metrology, Inspection, and Process Control for Microlithography XXIX
KEYWORDS: Oxides, Lithography, Metrology, Etching, Metals, Scatterometry, Double patterning technology, Critical dimension metrology, Semiconducting wafers, Overlay metrology

PROCEEDINGS ARTICLE | May 1, 2014
Proc. SPIE. 9132, Optical Micro- and Nanometrology V
KEYWORDS: Oxides, Ellipsometry, Lithography, Reticles, Etching, Scanning electron microscopy, Scatterometry, Double patterning technology, Semiconducting wafers, Overlay metrology

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