Prof. C. Grant Willson
Rashid Engineering Regent Chair at Univ of Texas at Austin
SPIE Involvement:
Fellow status | Symposium Committee | Symposium Chair | Conference Chair | Author | Instructor
Publications (156)

PROCEEDINGS ARTICLE | March 22, 2018
Proc. SPIE. 10589, Advanced Etch Technology for Nanopatterning VII
KEYWORDS: Etching, Dry etching, Silicon, Chemistry, Scanning electron microscopy, Directed self assembly, Line edge roughness, Reactive ion etching, Semiconducting wafers

PROCEEDINGS ARTICLE | March 19, 2018
Proc. SPIE. 10584, Novel Patterning Technologies 2018
KEYWORDS: Thin films, Lithography, Silicon, Chemistry, Silicon films, Polymerization, Photomasks, Directed self assembly, Reactive ion etching, Thin film coatings

PROCEEDINGS ARTICLE | March 19, 2018
Proc. SPIE. 10586, Advances in Patterning Materials and Processes XXXV
KEYWORDS: Optical lithography, Spectroscopy, Silicon, Chromium, Reactive ion etching, Semiconducting wafers, Scanning transmission electron microscopy

PROCEEDINGS ARTICLE | March 21, 2017
Proc. SPIE. 10149, Advanced Etch Technology for Nanopatterning VI
KEYWORDS: Diffractive optical elements, Data modeling, Calibration, Etching, Sputter deposition, Ions, Chemistry, Physics, Plasma etching, Parallel computing, Semiconducting wafers, Plasma systems, Process engineering, Plasma, Anisotropy

SPIE Journal Paper | July 26, 2016
JM3 Vol. 15 Issue 03
KEYWORDS: Dielectrics, Optical lithography, Polymers, Semiconducting wafers, Ultraviolet radiation, Silicon, Solids, Thin films, Sodium, Near ultraviolet

PROCEEDINGS ARTICLE | March 25, 2016
Proc. SPIE. 9779, Advances in Patterning Materials and Processes XXXIII
KEYWORDS: Semiconductors, Lithography, Etching, Polymers, Silicon, Manufacturing, Oxygen, Line width roughness, Directed self assembly, Line edge roughness, Plasma

Showing 5 of 156 publications
Conference Committee Involvement (14)
SPIE Advanced Lithography
21 February 2016 | San Jose, United States
SPIE Advanced Lithography
23 February 2014 | San Jose, United States
SPIE Advanced Lithography
24 February 2013 | San Jose, United States
SPIE Advanced Lithography
12 February 2012 | San Jose, United States
SPIE Advanced Lithography
27 February 2011 | San Jose, United States
Showing 5 of 14 published special sections
Course Instructor
SC101: Introduction to Microlithography: Theory, Materials, and Processing
The course covers the physics of aerial image generation, the chemistry that is responsible for generation of differential solubility in resists, and the effects of processing variables on the final relief image. While optical exposure is the major topic of this course, both electron beam and x-ray exposure are addressed. The physics section provides explanation for partial coherence effects. The chemistry section provides detailed description methods for quantifying resist performance, and the process section uses the lithographic process as an outline for discussion-from wafer cleaning to resist stripping.
SC103: Chemically Amplified Resists
This course provides an overview of the theory, materials, and processes involved in lithographic pattern generation using chemically amplified resists. A perspective of the evolution of these materials is the basis of the introduction. The first section addresses the special problem of deep UV resist design and the research that led to deep UV resist development. This includes photoacid generators, high and low activation energy protecting groups, formulation and processing options and the influence of base (quenchers) on resist performance. The course includes a discussion of the chemistry and physics responsible for atmospheric contaminant sensitivity in acid catalyzed systems. There will be a discussion of resolution limits, line edge roughnss and performance trade offs in chemically amplified resists. The course will conclude with the instructor's view of the future.
SC622: Nano-Scale Patterning with Imprint Lithography
This course will start by discussing the basics of nanoimprint lithography including a discussion of the various kinds of imprint lithography. It will cover advantages and challenges of using imprint lithography for sub-100 nm and sub-50 nm patterning. The course will focus on step and repeat UV nanoimprint lithography tools and processes. Specific topics addressed will include: tool design and performance, process resolution limits, CD control, etch requirements, overlay alignment, process defects, materials development, and 1X mask infrastructure. Potential applications of the technology will also be discussed.
SIGN IN TO:
  • View contact details

UPDATE YOUR PROFILE
Is this your profile? Update it now.
Don’t have a profile and want one?

Back to Top