Dr. Carmen Zoldesi
at ASML Netherlands BV
SPIE Involvement:
Author
Publications (6)

PROCEEDINGS ARTICLE | March 18, 2016
Proc. SPIE. 9776, Extreme Ultraviolet (EUV) Lithography VII
KEYWORDS: Reticles, Scanners, Manufacturing, Pellicles, Photomasks, Extreme ultraviolet, Extreme ultraviolet lithography, Logic devices, Semiconducting wafers, Overlay metrology, Tin, Fiber optic illuminators

PROCEEDINGS ARTICLE | March 18, 2016
Proc. SPIE. 9776, Extreme Ultraviolet (EUV) Lithography VII
KEYWORDS: Reticles, Optical lithography, Imaging systems, Scanners, Particles, Inspection, Pellicles, Photomasks, Extreme ultraviolet, Extreme ultraviolet lithography, High volume manufacturing, Semiconducting wafers

PROCEEDINGS ARTICLE | March 13, 2015
Proc. SPIE. 9422, Extreme Ultraviolet (EUV) Lithography VI
KEYWORDS: Reticles, Logic, Imaging systems, Scanners, Manufacturing, Pellicles, Extreme ultraviolet, Extreme ultraviolet lithography, Semiconducting wafers, Overlay metrology

PROCEEDINGS ARTICLE | April 17, 2014
Proc. SPIE. 9048, Extreme Ultraviolet (EUV) Lithography V
KEYWORDS: Reticles, Particles, Silicon, Manufacturing, Pellicles, Extreme ultraviolet, Critical dimension metrology, Semiconducting wafers, Prototyping, Protactinium

PROCEEDINGS ARTICLE | April 1, 2009
Proc. SPIE. 7273, Advances in Resist Materials and Processing Technology XXVI
KEYWORDS: Contamination, Etching, Polymers, Scanners, Particles, Bridges, Critical dimension metrology, Photomicroscopy, Photoresist processing, Semiconducting wafers

PROCEEDINGS ARTICLE | April 4, 2008
Proc. SPIE. 6923, Advances in Resist Materials and Processing Technology XXV
KEYWORDS: Metrology, Scanners, Particles, Manufacturing, Inspection, Bridges, High volume manufacturing, Critical dimension metrology, Semiconducting wafers, Standards development

Showing 5 of 6 publications
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