Ms. Carol Boye
Project Manager at IBM Corp
SPIE Involvement:
Conference Program Committee | Author
Publications (5)

PROCEEDINGS ARTICLE | April 28, 2011
Proc. SPIE. 7971, Metrology, Inspection, and Process Control for Microlithography XXV
KEYWORDS: Etching, Inspection, Electron microscopes, Scanning electron microscopy, Data acquisition, Field effect transistors, Critical dimension metrology, Semiconducting wafers, Defect inspection

PROCEEDINGS ARTICLE | March 20, 2010
Proc. SPIE. 7636, Extreme Ultraviolet (EUV) Lithography
KEYWORDS: Reticles, Optical lithography, Defect detection, Inspection, Scanning electron microscopy, Photomasks, Extreme ultraviolet, Line edge roughness, Semiconducting wafers, Defect inspection

PROCEEDINGS ARTICLE | March 18, 2009
Proc. SPIE. 7271, Alternative Lithographic Technologies
KEYWORDS: Multilayers, Reticles, Defect detection, Inspection, Scanning electron microscopy, Wafer inspection, Photomasks, Extreme ultraviolet, Extreme ultraviolet lithography, Semiconducting wafers

PROCEEDINGS ARTICLE | May 24, 2004
Proc. SPIE. 5375, Metrology, Inspection, and Process Control for Microlithography XVIII
KEYWORDS: Wafer-level optics, Thin films, Etching, Metals, Annealing, Copper, Capacitance, Data processing, Semiconducting wafers, Chemical mechanical planarization

PROCEEDINGS ARTICLE | July 15, 2003
Proc. SPIE. 5041, Process and Materials Characterization and Diagnostics in IC Manufacturing
KEYWORDS: Semiconductors, Defect detection, Manufacturing, Inspection, Detector development, Semiconductor manufacturing, Semiconducting wafers, Failure analysis, Optics manufacturing, Overlay metrology

Conference Committee Involvement (4)
Data Analysis and Modeling for Patterning Control III
23 February 2006 | San Jose, California, United States
Data Analysis and Modeling for Process Control II
3 March 2005 | San Jose, California, United States
Data Analysis and Modeling for Process Control
26 February 2004 | Santa Clara, California, United States
Process and Materials Characterization and Diagnostics in IC Manufacturing II
27 February 2003 | Santa Clara, CA, United States
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