The dimensional scaling in IC manufacturing strongly drives the demands on CD and defect metrology techniques and their measurement uncertainties. Defect review has become as important as CD metrology and both of them create a new metrology paradigm because it creates a completely new need for flexible, robust and scalable metrology software. Current, software architectures and metrology algorithms are performant but it must be pushed to another higher level in order to follow roadmap speed and requirements. For example: manage defect and CD in one step algorithm, customize algorithms and outputs features for each R&D team environment, provide software update every day or every week for R&D teams in order to explore easily various development strategies. The final goal is to avoid spending hours and days to manually tune algorithm to analyze metrology data and to allow R&D teams to stay focus on their expertise. The benefits are drastic costs reduction, more efficient R&D team and better process quality.<p> </p> In this paper, we propose a new generation of software platform and development infrastructure which can integrate specific metrology business modules. For example, we will show the integration of a chemistry module dedicated to electronics materials like Direct Self Assembly features. We will show a new generation of image analysis algorithms which are able to manage at the same time defect rates, images classifications, CD and roughness measurements with high throughput performances in order to be compatible with HVM. In a second part, we will assess the reliability, the customization of algorithm and the software platform capabilities to follow new specific semiconductor metrology software requirements: flexibility, robustness, high throughput and scalability. Finally, we will demonstrate how such environment has allowed a drastic reduction of data analysis cycle time.
In this paper, approaches are explored for combining EUV with DSA for via layer patterning at the N7 and N5 logic nodes. Simulations indicate opportunity for significant LCDU improvement at the N7 node without impacting the required exposure dose. A templated DSA process based on NXE:3300 exposed EUV pre-patterns has been developed and supports the simulations. The main point of improvement concerns pattern placement accuracy with this process. It is described how metrology contributes to the measured placement error numbers. Further optimization of metrology methods for determining local placement errors is required. Next, also via layer patterning at the N5 logic node is considered. On top of LCDU improvement, the combination of EUV with DSA also allows for maintaining a single mask solution at this technology node, due to the ability of the DSA process to repair merging vias. It is experimentally shown, how shaping of templates for such via multiplication helps in placement accuracy control. Peanut-shaped pre-patterns, which can be printed using EUV lithography, give significantly better placement accuracy control compared to elliptical pre-patterns.