Dr. Céline Lapeyre
at Commissariat à l'Energie Atomique
SPIE Involvement:
Author
Publications (20)

PROCEEDINGS ARTICLE | March 19, 2018
Proc. SPIE. 10584, Novel Patterning Technologies 2018
KEYWORDS: Semiconductors, Oxides, Optical lithography, Silicon, Materials processing, Photomasks, Directed self assembly, Critical dimension metrology, Photoresist processing, Semiconducting wafers

PROCEEDINGS ARTICLE | April 10, 2017
Proc. SPIE. 10149, Advanced Etch Technology for Nanopatterning VI
KEYWORDS: Lithography, Electron beam lithography, Etching, Line width roughness, Directed self assembly, Nanoimprint lithography, Critical dimension metrology, Photoresist processing, Semiconducting wafers, System on a chip

PROCEEDINGS ARTICLE | March 21, 2017
Proc. SPIE. 10144, Emerging Patterning Technologies
KEYWORDS: Lithography, Polymethylmethacrylate, Polymers, Image processing, Inspection, Scanning electron microscopy, Directed self assembly, Immersion lithography, Picosecond phenomena, Semiconducting wafers

SPIE Journal Paper | October 18, 2016
JM3 Vol. 15 Issue 04
KEYWORDS: Directed self assembly, Optical lithography, Annealing, Picosecond phenomena, Critical dimension metrology, Scanning electron microscopy, Materials processing, Semiconducting wafers, Lithography, Molecular self-assembly

SPIE Journal Paper | April 27, 2016
JM3 Vol. 15 Issue 02
KEYWORDS: Directed self assembly, Critical dimension metrology, Polymethylmethacrylate, Smoothing, Image processing, Materials processing, Edge detection, Polymers, Error analysis, Metrology

PROCEEDINGS ARTICLE | April 1, 2016
Proc. SPIE. 9777, Alternative Lithographic Technologies VIII
KEYWORDS: Lithography, Optical lithography, Etching, Image processing, Annealing, Scanning electron microscopy, Distance measurement, Directed self assembly, Immersion lithography, Semiconducting wafers

Showing 5 of 20 publications
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