Chang-Hyun Lim
at SAMSUNG Electro-Mechanics
SPIE Involvement:
Author
Publications (1)

Proceedings Article | 21 April 2006
Proc. SPIE. 6185, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration
KEYWORDS: Packaging, Light emitting diodes, Microlens array, Microlens, Semiconducting wafers, Silicon, Solid state lighting, Photoresist materials, Wafer-level optics, Nickel

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