In large high-power laser devices,the surface and subsurface defects of fused silica optical components directly affect the laser damage threshold and imaging quality. In this paper, fluorescence imaging technology is used to obtain images of defects in the subsurface layer of optical components that will absorb laser. Because the original image has the characteristics of sparse signal, weak intensity, low contrast, etc. In order to efficiently and reliably evaluate the surface and subsurface defects, this paper proposes a weak and small defect detection method based on local adaptive contrast enhancement and seed region growth. Firstly, the local adaptive contrast enhancement method is used to enhance the contrast of the original image. Secondly, the method of bilateral filtering is used to denoise. Thirdly, seed region growth method is used to segment the defective regions and perform morphological processing. Finally, defect detection is performed. The experiment uses different segmentation methods to detect images in different regions. The results show that this method can significantly enhance the contrast of the original fluorescence image, and detect pixel-level defects, and the detection rate is stable at about 95%. Meanwhile, the reasons, size distribution and other characteristics of the sub-surface defects of fused silica optical components are analyzed. This paper provides a nondestructive method of detecting weak and small defects in the subsurface layer of the optical element faster and higher accuracy.
Large-diameter optical components are important parts of the high-power laser facility [1, 2], and generally have a diameter greater than 400 mm × 400 mm. It is important for the detection of the surface and internal characteristics of large-diameter optical components [3, 4]. Since large-diameter optical components have a large imaging range and a certain thickness (generally over 50 mm), how to achieve high-resolution imaging over the entire thickness of large-diameter optical components becomes a challenge. This paper proposes to use medium format CMOS to realize large field microscopy imaging to ensure that the imaging range meets the field of view requirements of large aperture optical components. At the same time, a microscopic imaging lens with a magnification of 1.5 is designed to ensure that the object resolution is 4.5μm. Simulation experiments show that the system takes advantage of microscopic imaging, wavefront coding, and medium-format large targets. The imaging system can clearly image the entire large-diameter optical component over a long depth of field, improving the detection efficiency and detection accuracy of large-diameter optical components.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.