Cheng-Yu Tsai
at National Changhua Univ of Education
SPIE Involvement:
Author
Publications (1)

PROCEEDINGS ARTICLE | December 19, 2017
Proc. SPIE. 10613, 2017 International Conference on Robotics and Machine Vision
KEYWORDS: Packaging, Digital image processing, Image processing, Inspection, Feature extraction, Image analysis, Image quality, Image enhancement, Integrated circuits, Semiconducting wafers

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