Dr. Chi-Yuan Shih
at Taiwan Semiconductor Manufacturing Co Ltd
SPIE Involvement:
Author
Publications (7)

PROCEEDINGS ARTICLE | April 2, 2010
Proc. SPIE. 7638, Metrology, Inspection, and Process Control for Microlithography XXIV
KEYWORDS: Lithography, Metrology, Scanners, Scatterometry, 3D metrology, Finite element methods, Critical dimension metrology, Semiconducting wafers, Overlay metrology, Back end of line

PROCEEDINGS ARTICLE | December 12, 2009
Proc. SPIE. 7520, Lithography Asia 2009
KEYWORDS: Wafer-level optics, Lithography, Data modeling, Calibration, Scanners, Optimization (mathematics), Semiconducting wafers, Yield improvement, Model-based design, Process modeling

PROCEEDINGS ARTICLE | December 11, 2009
Proc. SPIE. 7520, Lithography Asia 2009
KEYWORDS: Signal to noise ratio, Lithography, Metrology, Metals, Scanners, Scatterometry, Semiconducting wafers, Overlay metrology, Back end of line, Front end of line

PROCEEDINGS ARTICLE | March 24, 2009
Proc. SPIE. 7272, Metrology, Inspection, and Process Control for Microlithography XXIII
KEYWORDS: Carbon, Lithography, Refractive index, Birefringence, Scatterometry, Finite element methods, Critical dimension metrology, Semiconducting wafers, Absorption, Anisotropy

PROCEEDINGS ARTICLE | March 23, 2009
Proc. SPIE. 7272, Metrology, Inspection, and Process Control for Microlithography XXIII
KEYWORDS: Lithography, Metrology, Scanners, Scatterometry, Finite element methods, Photomasks, Double patterning technology, Critical dimension metrology, Semiconducting wafers, Overlay metrology

PROCEEDINGS ARTICLE | March 16, 2009
Proc. SPIE. 7274, Optical Microlithography XXII
KEYWORDS: Wafer-level optics, Lithography, Reticles, Data modeling, Calibration, Scanners, Manufacturing, Optical proximity correction, Semiconducting wafers, Model-based design

Showing 5 of 7 publications
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