Mr. Chinmoy P. Saha
Engineer at Apparati Inc
SPIE Involvement:
Author
Publications (1)

PROCEEDINGS ARTICLE | March 11, 2005
Proc. SPIE. 5731, Photonics Packaging and Integration V
KEYWORDS: Microelectromechanical systems, Packaging, Microsystems, Manufacturing, 3D modeling, Radiative energy transfer, Optoelectronics, Finite element methods, Chemical elements, Radiation effects

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