Dr. Chris A. Mack
Gentleman Scientist at Fractilia LLC
SPIE Involvement:
| Awards Committee | Board of Directors | Nominating Committee | Publications Committee | Fellow status | Symposium Committee | Conference Chair | Conference Program Committee | Journal Editor-in-Chief | Author | Editor | Instructor
Area of Expertise:
Photolithography , Modeling , Microlithography , Stochastic Modeling
Websites:
Profile Summary

Chris A. Mack received Bachelor of Science degrees in physics, chemistry, electrical engineering, and chemical engineering from Rose-Hulman Institute of Technology in 1982, a Master of Science degree in electrical engineering from the University of Maryland in 1989, and a Ph.D. in chemical engineering from the University of Texas at Austin in 1998. Mr. Mack founded FINLE Technologies, the developer of the lithography simulation software PROLITH, in 1990, serving as President and Chief Technical Officer until the acquisition of FINLE by KLA-Tencor in 2000. For the next five years he served as Vice President of Lithography Technology for KLA-Tencor. In 2003 he received the SEMI Award for North America for his efforts in lithography simulation and education. He became a fellow of SPIE in 2006, and a fellow of IEEE in 2010. In 2009 he received the SPIE Frits Zernike Award for Microlithography. He is also an adjunct faculty member at the University of Texas at Austin and spent the Fall 2006 semester as a visiting professor at the University of Notre Dame. He has recently completed a comprehensive graduate-level textbook on optical lithography, Fundamental Principles of Optical Lithography, published in late 2007. In 2012 he become Editor-In-Chief of the Journal of Micro/Nanolithography, MEMS, and MOEMS (JM3). Currently, he writes, teaches, and consults on the field of semiconductor microlithography in Austin, Texas.
Publications (206)

PROCEEDINGS ARTICLE | May 22, 2018
Proc. SPIE. 10583, Extreme Ultraviolet (EUV) Lithography IX
KEYWORDS: Mathematical modeling, Lithography, Chemical species, Particles, Molecules, Photoresist materials, Extreme ultraviolet, Extreme ultraviolet lithography, Failure analysis, Stochastic processes

SPIE Journal Paper | May 3, 2018
JM3 Vol. 17 Issue 02
KEYWORDS: Stochastic processes, Lithography, Optical lithography, Photons, Molecules, Semiconductors, Materials processing, Metrology, Etching, Extreme ultraviolet lithography

PROCEEDINGS ARTICLE | March 30, 2018
Proc. SPIE. 10585, Metrology, Inspection, and Process Control for Microlithography XXXII
KEYWORDS: Image processing, Materials processing, Image acquisition, Scanning electron microscopy, Image filtering, Extreme ultraviolet, Line width roughness, Double patterning technology, Line edge roughness, Material characterization

PROCEEDINGS ARTICLE | March 28, 2018
Proc. SPIE. 10585, Metrology, Inspection, and Process Control for Microlithography XXXII
KEYWORDS: Semiconductors, Metrology, Image acquisition, Atomic force microscopy, Scanning electron microscopy, Time metrology, Finite element methods, Line width roughness, Semiconducting wafers, Standards development

PROCEEDINGS ARTICLE | March 23, 2018
Proc. SPIE. 10587, Optical Microlithography XXXI
KEYWORDS: Scanning electron microscopy, Line width roughness

PROCEEDINGS ARTICLE | March 22, 2018
Proc. SPIE. 10589, Advanced Etch Technology for Nanopatterning VII
KEYWORDS: Etching, Dry etching, Silicon, Chemistry, Scanning electron microscopy, Directed self assembly, Line edge roughness, Reactive ion etching, Semiconducting wafers

Showing 5 of 206 publications
Conference Committee Involvement (17)
SPIE Advanced Lithography
21 February 2016 | San Jose, United States
SPIE Advanced Lithography
23 February 2014 | San Jose, United States
SPIE Advanced Lithography
24 February 2013 | San Jose, United States
SPIE Advanced Lithography
12 February 2012 | San Jose, United States
SPIE Advanced Lithography
27 February 2011 | San Jose, United States
Showing 5 of 17 published special sections
Course Instructor
SC116: Lithographic Optimization: A Theoretical Approach
This course discusses the techniques required to characterize and optimize an optical lithography process. The lithographic process is made up of a series of basic steps: the formation of an aerial image, the transfer of the aerial image into the photoresist during exposure, and the development of this latent image into the final photoresist profile. In order to characterize and optimize this process one must understand the principles and interactions of each step of the process.
SC1173: How and Why: The big ideas in semiconductor lithography
Moore’s Law has been changing the world for over 50 years, and advances in lithography have been a (the) major factor in its success. This course will review several major conceptual and technical underpinnings of lithography for semiconductor manufacturing, providing a large, holistic view of where we are, how we got here, and where we are going next. Topics include Moore’s Law, resolution and depth of focus, the components of optical resolution, chemically amplified resists, lithography impacts on design, and next generation lithography. 1. Moore’s Law – History, components, meaning, Dennard scaling, impact on lithography 2. The focus-exposure matrix, depth of focus, and the Normalized Image Log-Slope (NILS) 3. Chemically amplified resists, acid and quencher diffusion, and isofocal bias 4. Imaging, resolution, and the change from three-beam to two-beam imaging 5. Design – WYSIWYG, design rules, litho-friendly design 6. The Future – what will be the next generation of lithography? How will it impact Moore’s Law?
SC102: Optical Lithography Modeling
This course presents the theory and applications of optical lithography simulation tools. Using examples, practical applications to typical material and image problems will be discussed.
SC268: Introduction to Optical Lithography
This course discusses the basic principles and techniques of an optical lithography process. The course gives a general overview of optical lithography and goes into some depth on important topics.
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