Immersion Lithography continues to get more and more attention as a possible solution for the 45nm technology node puzzle. In 2005, there has, indeed, been a lot of progress made. It has gone from a laboratory curiosity to being one of the industry's prime contenders for the lithography technology of choice for the 45nm node. Yet a lot of work remains to be done before it's fully implemented into production. Today, there are over a dozen full field immersion scanners in R&D and pilot lines all around the world. The first full field, pre-production "Alpha" version of the ASML Twinscan AT 1150i was delivered to Albany NanoTech in August, 2004. A consortium made up of AMD, IBM, Infineon, and Micron Technology began early evaluation of immersion technology and in December of 2004, the production of the world's first Power PC microprocessor using immersion lithography, processed on this tool, was announced by IBM.
This paper will present a summary of some of the work that was done on this system over the past year. It will also provide an overview of Albany NanoTech, the facility, its capabilities, and the programs in place. Its operating model, which is heavily focused on cooperative joint ventures, is described. The immersion data presented is a review of the work done by AMD, IBM, Infineon Technologies, and Micron Technology, all members of the INVENT Lithography Consortium in place at Albany NanoTech. All the data was published and presented by the authors in much more detail at the 2005 International Symposium on Immersion Lithography, in Bruges, Belgium.
The use of modern microstreolithography (MSL) technology gives optics developers the freedom to integrate mounting and positioning structures directly into an optical mask structure. We have created Hadamard spectrometer masks with increments of 150 μm and less using the Sony SCS-6000 microstereolithography apparatus (MSLA). Due to laser over cure and other parameters, adjustments were made iteration by iteration until appropriate mask tolerances were met. A mounting structure was integrated with the mask for testing and application. At the computer aided design (CAD) model level, the mounting geometry can be adjusted to fit any specific mounting apparatus. By using the MSLA, features as small as 75 μm and larger than 300 mm can be created in the same build. Additionally, the conceptual design of an entire positioning system constructed using layer additive MSLA microfabrication is underway. This positioning system may be built as an integrated assembly, encapsulating necessary components. Optical characterization results are presented.