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Chris C. Young
at KLA Corp
SPIE Involvement:
Author
Publications (5)
Proceedings Article | 2 April 2010 Paper
Detection of photo resist residue on advanced gate layers using optical scattering and advanced analysis techniques
Scott Ku, Ying-Hsueh Chang Chien, C. Yang, Elvis Wang, Damian Chen, Chris Young, Kevin Sun, Jack Yan, Prasanna Dighe, Avinash Saldanha, David Feiler
Proceedings Volume 7638, 76383F (2010) https://doi.org/10.1117/12.847797
KEYWORDS: Semiconducting wafers, Luminescence, Air contamination, Scattering, Wafer-level optics, Process control, Metrology, Inspection, Metals, Signal attenuation
Proceedings Article | 4 December 2008 Paper
Accelerating 32nm BEOL technology development by advanced wafer inspection methodology
P. R. Jeng, C. Lin, Simon Jang, M. Liang, Wallas Chen, David Tsui, Damian Chen, Henry Chen, Chris Young, Ellis Chang
Proceedings Volume 7140, 71400S (2008) https://doi.org/10.1117/12.804526
KEYWORDS: Inspection, Photomasks, Optical proximity correction, Wafer inspection, Back end of line, Library classification systems, Semiconducting wafers, Copper, Defect inspection, Semiconductor manufacturing
Proceedings Article | 16 April 2008 Paper
Advanced method to monitor design-process marginality for 65nm node and beyond
Crockett Huang, Chris Young, Hermes Liu, S. Tzou, David Tsui, Ellis Chang
Proceedings Volume 6922, 69222D (2008) https://doi.org/10.1117/12.772131
KEYWORDS: Optical proximity correction, Inspection, Scanners, Semiconducting wafers, Head, Process engineering, Communication engineering, Reticles, Etching, Defect inspection
Proceedings Article | 16 April 2008 Paper
Defect criticality index (DCI): a new methodology to significantly improve DOI sampling rate in a 45nm production environment
Yoshiyuki Sato, Yasuyuki Yamada, Yasuhiro Kaga, Yuuichiro Yamazaki, Masami Aoki, David Tsui, Chris Young, Ellis Chang
Proceedings Volume 6922, 692213 (2008) https://doi.org/10.1117/12.771917
KEYWORDS: Scanning electron microscopy, Inspection, Semiconducting wafers, Particles, Wafer inspection, Defect detection, Environmental sensing, Defect inspection, Environmental monitoring, Metals
Proceedings Article | 4 March 2008 Paper
Effective learning and feedback to designers through design and wafer inspection integration
Crockett Huang, Hermes Liu, S. F. Tzou, Allen Park, Chris Young, Ellis Chang
Proceedings Volume 6925, 692506 (2008) https://doi.org/10.1117/12.772242
KEYWORDS: Semiconducting wafers, Data modeling, Inspection, Metrology, Optical proximity correction, Finite element methods, Wafer inspection, Model-based design, Design for manufacturing, Defect inspection
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