Mr. Chris C. Young
at KLA-Tencor Corp
SPIE Involvement:
Author
Publications (5)

PROCEEDINGS ARTICLE | April 2, 2010
Proc. SPIE. 7638, Metrology, Inspection, and Process Control for Microlithography XXIV
KEYWORDS: Wafer-level optics, Metrology, Scattering, Signal attenuation, Air contamination, Metals, Luminescence, Inspection, Process control, Semiconducting wafers

PROCEEDINGS ARTICLE | December 4, 2008
Proc. SPIE. 7140, Lithography Asia 2008
KEYWORDS: Copper, Inspection, Wafer inspection, Photomasks, Semiconductor manufacturing, Optical proximity correction, Semiconducting wafers, Library classification systems, Back end of line, Defect inspection

PROCEEDINGS ARTICLE | April 16, 2008
Proc. SPIE. 6922, Metrology, Inspection, and Process Control for Microlithography XXII
KEYWORDS: Environmental monitoring, Defect detection, Metals, Particles, Inspection, Scanning electron microscopy, Wafer inspection, Semiconducting wafers, Environmental sensing, Defect inspection

PROCEEDINGS ARTICLE | April 16, 2008
Proc. SPIE. 6922, Metrology, Inspection, and Process Control for Microlithography XXII
KEYWORDS: Reticles, Etching, Scanners, Inspection, Head, Optical proximity correction, Semiconducting wafers, Process engineering, Communication engineering, Defect inspection

PROCEEDINGS ARTICLE | March 4, 2008
Proc. SPIE. 6925, Design for Manufacturability through Design-Process Integration II
KEYWORDS: Metrology, Data modeling, Inspection, Finite element methods, Design for manufacturing, Wafer inspection, Optical proximity correction, Semiconducting wafers, Model-based design, Defect inspection

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