Mr. Christian Stief
at Applied Materials GmbH
SPIE Involvement:
Author
Publications (5)

PROCEEDINGS ARTICLE | March 24, 2006
Proc. SPIE. 6152, Metrology, Inspection, and Process Control for Microlithography XX
KEYWORDS: Image processing, Pattern recognition, Manufacturing, Inspection, Scanning electron microscopy, Time metrology, Photomasks, Optical proximity correction, Computer aided design, Semiconducting wafers

PROCEEDINGS ARTICLE | May 10, 2005
Proc. SPIE. 5752, Metrology, Inspection, and Process Control for Microlithography XIX
KEYWORDS: Metrology, Etching, Precision measurement, Process control, Photomasks, Feedback loops, Critical dimension metrology, Feedback control, Semiconducting wafers, Environmental sensing

SPIE Journal Paper | January 1, 2005
JM3 Vol. 4 Issue 01
KEYWORDS: Electron microscopy, Atomic force microscopy, 3D metrology, Line edge roughness, Reconstruction algorithms, Scanners, Finite element methods, Photoresist processing, Critical dimension metrology, Process control

PROCEEDINGS ARTICLE | May 24, 2004
Proc. SPIE. 5375, Metrology, Inspection, and Process Control for Microlithography XVIII
KEYWORDS: Lithography, Reticles, Spatial frequencies, Etching, Line width roughness, Critical dimension metrology, Line edge roughness, Molybdenum, Photoresist processing, Semiconducting wafers

PROCEEDINGS ARTICLE | June 2, 2003
Proc. SPIE. 5038, Metrology, Inspection, and Process Control for Microlithography XVII
KEYWORDS: Deep ultraviolet, Scanners, Silicon, Atomic force microscopy, Scanning electron microscopy, 3D metrology, Process control, Finite element methods, Line edge roughness, 3D image processing

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