Dr. Christian Wagner
Director of Product Management EUVL at ASML Netherlands BV
SPIE Involvement:
Conference Program Committee | Author
Publications (21)

PROCEEDINGS ARTICLE | March 18, 2016
Proc. SPIE. 9776, Extreme Ultraviolet (EUV) Lithography VII
KEYWORDS: Reticles, Scanners, Manufacturing, Pellicles, Photomasks, Extreme ultraviolet, Extreme ultraviolet lithography, Logic devices, Semiconducting wafers, Overlay metrology, Tin, Fiber optic illuminators

PROCEEDINGS ARTICLE | March 16, 2015
Proc. SPIE. 9422, Extreme Ultraviolet (EUV) Lithography VI
KEYWORDS: Light sources, Laser energy, High power lasers, Amplifiers, Extreme ultraviolet, Extreme ultraviolet lithography, High volume manufacturing, Pulsed laser operation, Plasma, Tin

PROCEEDINGS ARTICLE | March 13, 2015
Proc. SPIE. 9422, Extreme Ultraviolet (EUV) Lithography VI
KEYWORDS: Reticles, Logic, Imaging systems, Scanners, Manufacturing, Pellicles, Extreme ultraviolet, Extreme ultraviolet lithography, Semiconducting wafers, Overlay metrology

PROCEEDINGS ARTICLE | March 23, 2012
Proc. SPIE. 8322, Extreme Ultraviolet (EUV) Lithography III
KEYWORDS: Mirrors, Reticles, Scanners, Particles, Photomasks, Extreme ultraviolet, Line width roughness, Extreme ultraviolet lithography, Semiconducting wafers, Overlay metrology

PROCEEDINGS ARTICLE | October 14, 2011
Proc. SPIE. 8166, Photomask Technology 2011
KEYWORDS: Lithography, Metrology, Deep ultraviolet, Scanners, Reflectivity, Photomasks, Extreme ultraviolet, Extreme ultraviolet lithography, Critical dimension metrology, Semiconducting wafers

PROCEEDINGS ARTICLE | April 7, 2011
Proc. SPIE. 7969, Extreme Ultraviolet (EUV) Lithography II
KEYWORDS: Reticles, Contamination, Manufacturing, Extreme ultraviolet, Extreme ultraviolet lithography, Optical proximity correction, High volume manufacturing, Semiconducting wafers, Optics manufacturing, Overlay metrology

Showing 5 of 21 publications
Conference Committee Involvement (1)
Optical Fabrication, Testing, and Metrology
30 September 2003 | St. Etienne, France
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