There is a commercial trend in high data-rate systems to place optical components in close proximity to the data source/sink. This trend forgoes the traditional module packaging approach to create compact components that are embedded near or within the package of high-performance ASICs. This approach reduces the power consumption and electro-magnetic interference (EMI) effects by reducing the length of copper interconnect signal paths. We present an overview of commercial trends and methods for fielding this technology within spacecraft.
We present fiber optic technology for 850 nm, VCSEL-based embedded optical computing solutions. We introduce concepts for compact, rugged fiber optic transceivers that provide multi-channel operation at 12.5 Gbps per channel. The transceiver can be placed in close proximity to high performance ASICs to provide direct optical I/O between components. The transceiver is packaged with material having match coefficients of thermal expansion (CTE), and expanded beam optical interface – these features offer survivability and operation over wide temperature ranges.