Prof. Chwan-Huei Tsai Profile

Prof. Chwan-Huei Tsai

at Huafan Univ

SPIE Involvement:

Author

Publications (1)

This will count as one of your downloads.

You will have access to both the presentation and article (if available).

DOWNLOAD NOW

This content is available for download via your institution's subscription. To access this item, please sign in to your personal account.

Email or Username Forgot your username?

Password Forgot your password?

Show

Keep me signed in

No SPIE account? Create an account

Proceedings Article | 24 February 2009 Paper

Pulsed laser breaking technique for glass substrates

Chwan-Huei Tsai, Wei-Han Chang

Proceedings Volume 7204, 72040A (2009) https://doi.org/10.1117/12.809728

KEYWORDS: Glasses, Laser cutting, Pulsed laser operation, Carbon dioxide lasers, Diamond, Laser processing, Image processing, LCDs, Laser energy, Photography

Read Abstract +

The aim of this paper is to present the pulsed laser breaking technique, a technique that further builds on the unstable fracture technique. In this study, a diamond-point scoring tool was used to scribe a groove and create a median crack (grooved-crack) along the cutting path in a glass substrate. A pulsed CO2 laser was then applied at the cutting path to cut the glass substrate. A crack developed in the grooved-crack after the first laser pulse, increased in length after the second pulse, and then extended unstably after the third. The scribed grooved-crack determined the direction of crack propagation. The glass substrate separated along the scribed path. The surface of the separated pieces was free of microcracks common to mechanical breaking. The scribe force and groove depth were established and the laser parameters were set. Photographs of the glass substrate surface were obtained to analyze the cutting quality. An image processing system of crack detection was employed to obtain the crack image continuously during the laser breaking process. The stress analyses via ANSYS were performed to explain the mechanism of the breaking process that has been successfully developed in this study on cutting LCD glass substrates.

My Library

You currently do not have any folders to save your paper to! Create a new folder below.

Folder Name

Folder Description

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks. You are receiving this notice because your organization may not have SPIE eBooks access.*

*Shibboleth/Open Athens users─please sign in to access your institution's subscriptions.

To obtain this item, you may purchase the complete book in print or electronic format on SPIE.org.

ORGANIZATIONAL
Sign in with credentials provided by your organization.

Organizational Username

Organizational Password

Show/Hide Password

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members:

Non-members: ADD TO CART

Keywords/Phrases

Search In:

Publication Years