Dr. Colin K. Drummond
at ASM International
SPIE Involvement:
Conference Program Committee | Author
Publications (1)

Proceedings Article | 19 February 2008
Proc. SPIE. 6884, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII
KEYWORDS: Microelectromechanical systems, Packaging, Clocks, Microsystems, Data modeling, Databases, Materials processing, Reliability, Computer aided design, Tolerancing

Conference Committee Involvement (1)
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII
28 January 2009 | San Jose, California, United States
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