Lowering optical packaging costs requires developments in new technologies. In this paper, solder ink-jet process is presented for flip-chip component assembly on planar, 3D, flex and stacked submounts and substrates. Applications for this technology are presented and include linear array in-vivo dosimeters, integrated GaN LED displays, telecomm submounts and wearable ambient systems. An important aspect of developing this technology is process reliability. In this study, the reliability of the solder to bump accurately and adhere to various target bond pads was evaluated as well as MIL standard shear tests to qualify the joint strength of the bump.