Proc. SPIE. 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III
KEYWORDS: Microelectromechanical systems, Reliability, Physics, 3D modeling, Capacitance, Profilometers, Finite element methods, Material characterization, Failure analysis, Commercial off the shelf technology
COTS (Commercial-off-the-shelf) MEMS components are very interesting for space applications because they are lightweight, small, economic in energy, cheap and available in short delays. The reliability of MEMS COTS that are used out of their intended domain of operation (such as a space application) might be assured by a reliability methodology derived from the Physics of Failure approach. In order to use this approach it is necessary to create models of MEMS components that take into consideration environmental stresses and thus can be used for lifetime prediction. Unfortunately, today MEMS failure mechanisms are not well understood today and therefore a preliminary work is necessary to determine influent factors and physical phenomena. The model development is based on a good knowledge of the process parameters (Young’s modulus, stress...), environmental tests and appropriated modeling approaches, such a finite element analysis (FEA) and behavioural modeling. In order to do the environmental tests and to analyse MEMS behaviour, we have developed the Environmental MEMS Analyzer EMA 3D. The described methodology has been applied to a Commercial-off-the-shelf (COTS) accelerometer, the ADXL150. A first level behavioral model was created and then refined in the following steps by the enrichment with experimental results and finite element simulations.