Dr. Daniel J. Dechene
Senior Member of Technical Staff at GLOBALFOUNDRIES
SPIE Involvement:
Author
Publications (7)

PROCEEDINGS ARTICLE | October 5, 2016
Proc. SPIE. 9985, Photomask Technology 2016
KEYWORDS: Lithography, Defect detection, Inspection, Optical inspection, Wafer inspection, Photomasks, Extreme ultraviolet, Critical dimension metrology, Semiconducting wafers, Defect inspection

PROCEEDINGS ARTICLE | September 26, 2016
Proc. SPIE. 9985, Photomask Technology 2016
KEYWORDS: Lithography, Reticles, Defect detection, Sensors, Error analysis, Inspection, Attenuators, Photomasks, Optical proximity correction, Semiconducting wafers

PROCEEDINGS ARTICLE | March 18, 2015
Proc. SPIE. 9427, Design-Process-Technology Co-optimization for Manufacturability IX
KEYWORDS: Lithography, Logic, Optical lithography, Etching, Scanners, Photomasks, Source mask optimization, Optical proximity correction, Semiconducting wafers, Process modeling

PROCEEDINGS ARTICLE | March 31, 2014
Proc. SPIE. 9052, Optical Microlithography XXVII
KEYWORDS: Lithography, Optical lithography, 3D modeling, Monte Carlo methods, Photomasks, Directed self assembly, Computational lithography, Critical dimension metrology, Photoresist processing, Instrument modeling

PROCEEDINGS ARTICLE | October 1, 2013
Proc. SPIE. 8880, Photomask Technology 2013
KEYWORDS: Lithography, Metrology, Logic, Data modeling, Chromium, Photomasks, Immersion lithography, SRAF, Critical dimension metrology, Semiconducting wafers

PROCEEDINGS ARTICLE | September 23, 2013
Proc. SPIE. 8880, Photomask Technology 2013
KEYWORDS: Lithography, Reticles, Defect detection, Opacity, Inspection, Photomasks, Optical proximity correction, SRAF, Critical dimension metrology, Semiconducting wafers

Showing 5 of 7 publications
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