Dandan Han
Masters Candidate at Zhejiang Univ
SPIE Involvement:
Author
Publications (4)

Proceedings Article | 5 November 2018 Paper
Proceedings Volume 10815, 108151H (2018) https://doi.org/10.1117/12.2502273
KEYWORDS: Adhesives, Microopto electromechanical systems, Interferometry, Finite element methods, Silicon, Packaging, Thermal effects, Microelectromechanical systems, Thermal modeling, Sensors

Proceedings Article | 25 October 2016 Paper
Qianbo Lu, Jian Bai, Kaiwei Wang, Shuqi Lou, Xufen Jiao, Dandan Han
Proceedings Volume 9685, 968504 (2016) https://doi.org/10.1117/12.2241339
KEYWORDS: Microopto electromechanical systems, Diffraction gratings, Sensors, Mechanical sensors, Diffraction, Structural sensing, Finite element methods, Silicon, Semiconducting wafers, Etching

Proceedings Article | 28 August 2016 Presentation + Paper
Dandan Han, Jian Bai, Qianbo Lu, Shuqi Lou, Xufen Jiao, Guoguang Yang
Proceedings Volume 9960, 99600X (2016) https://doi.org/10.1117/12.2236584
KEYWORDS: Interferometry, Finite element methods, Performance modeling, Microopto electromechanical systems, Quantitative analysis, Modulation, Mechanical sensors, Temperature metrology, Microelectromechanical systems, Diffraction gratings

Proceedings Article | 28 August 2016 Presentation + Paper
Qianbo Lu, Jian Bai, Kaiwei Wang, Shuqi Lou, Xufen Jiao, Dandan Han, Guoguang Yang
Proceedings Volume 9960, 99600W (2016) https://doi.org/10.1117/12.2235409
KEYWORDS: Microopto electromechanical systems, Interferometry, Mechanical engineering, Mechanical sensors, Optical design, Finite element methods, Mechanical engineering, Mirrors, Silicon, 3D modeling, Lanthanum

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