The challenge of rapid footstep detection and classification in remote locations has long been an important area of study for defense technology and national security. Also, as the military seeks to create effective and disposable unattended ground sensors (UGS), computational complexity and power consumption have become essential considerations in the development of classification techniques. In response to these issues, a research project at the Flexible Display Center at Arizona State University (ASU) has experimented with footstep classification using the matching pursuit decomposition (MPD) time-frequency analysis method. The MPD provides a parsimonious signal representation by iteratively selecting matched signal components from a pre-determined dictionary. The resulting time-frequency representation of the decomposed signal provides distinctive features for different types of footsteps, including footsteps during walking or running activities. The MPD features were used in a Bayesian classification method to successfully distinguish between the different activities. The computational cost of the iterative MPD algorithm was reduced, without significant loss in performance, using a modified MPD with a dictionary consisting of signals matched to cadence temporal gait patterns obtained from real seismic measurements. The classification results were demonstrated with real data from footsteps under various conditions recorded using a low-cost seismic sensor.
In this work we demonstrate high performance and low-power n-type inverters using solution-based CdS as the semiconductor in thin film transistors. Our fabrication process consists of five mask levels and a maximum temperature of 150 °C. The CdS is deposited using chemical bath deposition at 70 °C to provide full compatibility with flexible substrates. Isolated TFTs showed mobilities up to 10 cm<sup>2</sup>/V-s and threshold voltages of approximately 0.5V. Inverters were biased at 1, 3 and 5 V, resulting in maximum gains in the range of 60 at V<sub>DD</sub> = 3V. The devices and circuits are fully patterned using standard photolithographic techniques that can be used to design more complex circuitry for flexible and large area electronic applications. In addition we used an extraction parameter method for our TFTs that allows the use of regular SPICE simulation software to design and test the circuits. Our simulations are in good agreement with the experimental data for isolated devices and inverters. Other circuits such as NAND gates are also demonstrated.
Today’s flat panel digital x-ray image sensors, which have been in production since the mid-1990s, are produced exclusively on glass substrates. While acceptable for use in a hospital or doctor’s office, conventional glass substrate digital x-ray sensors are too fragile for use outside these controlled environments without extensive reinforcement. Reinforcement, however, significantly increases weight, bulk, and cost, making them impractical for far-forward remote diagnostic applications, which demand rugged and lightweight x-ray detectors. Additionally, glass substrate x-ray detectors are inherently rigid. This limits their use in curved or bendable, conformal x-ray imaging applications such as the non-destructive testing (NDT) of oil pipelines. However, by extending low-temperature thin-film transistor (TFT) technology previously demonstrated on plastic substrate- based electrophoretic and organic light emitting diode (OLED) flexible displays, it is now possible to manufacture durable, lightweight, as well as flexible digital x-ray detectors. In this paper, we discuss the principal technical approaches used to apply flexible display technology to two new large-area flexible digital x-ray sensors for defense, security, and industrial applications and demonstrate their imaging capabilities. Our results include a 4.8″ diagonal, 353 x 463 resolution, flexible digital x-ray detector, fabricated on a 6″ polyethylene naphthalate (PEN) plastic substrate; and a larger, 7.9″ diagonal, 720 x 640 resolution, flexible digital x-ray detector also fabricated on PEN and manufactured on a gen 2 (370 x 470 mm) substrate.
In this work we assess the feasibility of ZnO films deposited from a sol gel precursor as a material for thin film charged particle detectors. There are many reports of polycrystalline ZnO thin film transistors (TFTs) in the literature, deposited by sputtering, pulsed laser deposition, and sol gel. There are also reports of sol gel derived ZnO doped with Li or Mg to increase the resistivity, however, these works only measure resistivity of the films, without determining the effect of doping on the carrier concentration. We study the effects of doping the ZnO with Mg and Li as well as the effects of thickness on the films’ resistivity, mobility, and carrier concentration, since these material parameters are critical for a charged particle sensor. Carrier concentration is particularly important because it must be kept low in order for the intrinsic region of a p-i-n diode to be depleted. In order to accomplish this we fabricate and electrically characterize test structures for resistivity, test structures for hall measurement, common back-gate TFTs, and metal-insulator-semiconductor (MIS) capacitors. We also conduct physical characterization techniques such as x-ray diffraction (XRD), atomic force microscopy (AFM), electron microscopy, UV-Vis spectroscopy, and ellipsometry to determine the effect of doping and film thickness on the microstructure and optical properties of the ZnO.
Large area, flexible sensing arrays for imaging, biochemical sensing and radiation detection are now possible with the development of flexible active matrix display technology. In particular, large-area flexible imaging arrays can provide considerable advancement in defense and security industries because of their inherent low manufacturing costs and physical plasticity that allows for increased adaptability to non-planar mounting surfaces. For example, a flexible array of photodetectors and lenslets formed into a cylinder could image simultaneously with a 360 degree view without the need for expensive bulky optics or a gimbaled mount. Here we report the design and development of a scalable 16x16 pixel testbed for flexible sensor arrays using commercial-off-the-shelf (COTS) parts and demonstrate the capture of a shadow image with an array of photodiodes and active pixel sensors on a plastic substrate. The image capture system makes use of an array of low-noise, InGaZnO active pixel amplifiers to detect changes in current in 2.4 μm-thick reverse-biased a-Si:H PIN diodes. A thorough characterization of the responsivity, detectivity, and optical gain of an a- Si:H photodiode is also provided. At the back end, analog capture circuitry progressively scans the array and constructs an image based on the electrical activity in each pixel. The use of correlated-double-sampling to remove fixed pattern noise is shown to significantly improve spatial resolution due to process variations. The testbed can be readily adapted for the development of neutron, alpha-particle, or X-ray detection arrays given an appropriate conversion layer.
The U.S. Army, Arizona State University (ASU) and commercial industry have joined forces to create the Flexible Display Center (FDC) at Arizona State University, a large-scale collaborative venture designed to rapidly advance flexible display technology to the brink of commercialization. The Center has completed its startup phase and is now engaged in an intensive and aggressive applied research and development program that will produce high quality, high performance active matrix reflective and emissive flexible display technology demonstrators (TDs). Electrophoretic ink and cholesteric liquid crystals have been selected as Center reflective imaging layer technologies; these technologies are attractive because they are fully reflective and bistable (extremely low power) and because the materials are environmentally robust and intrinsically rugged. Organic light emitting devices (OLEDs) have been chosen as the emissive imaging layer technology. These three electro-optic subsystems will be integrated with a flexible a-Si thin film transistor active matrix backplane platform. We have created the integrated design, backplane fabrication, display assembly, test and evaluation capability to enable rapid cycles of learning and technology development. Backplane fabrication is currently accomplished on a 6” wafer scale pilot line linked to a Manufacturing Execution System and supported by a comprehensive suite of in-fab metrology tools. We are currently installing a GEN II pilot line, with qualified operation slated for 2006. This line will be used to demonstrate process and display form factor capability, while providing high yield low volume manufacturing of pilot-scale levels of technology demonstrators for the Army and our commercial partners.