Remote Hyperspectral and Multispectral sensors have been developed using modern CCD and CMOS fabrication
techniques combined with advanced dichroic filters. The resulting sensors are more cost effective while maintaining the
high performance needed in remote sensing applications. A single device can contain multiple imaging areas tailored to
different multispectral bandwidths in a highly cost effective and reliable package. This paper discusses a five band
visible to near IR scanning sensor. By bonding advanced dichroic filters onto the cover glass and directly in the imaging
path a highly efficient multispectral sensor is achieved. Up to 12,000 linear pixel arrays are possible1 with this advanced
filter technology approach. Individual imaging areas on the device are designed to have unique pixel sizes and clocking
to enable tailored imaging performance for the individual spectral bands. Individual elements are also based on high
resolution Time Delay and Integration technology2,3 (TDI) to maximize sensitivity and throughput. Additionally for
hyperspectral imagers, a split frame CCD design is discussed using high sensitivity back side illuminated (BSI)
processes that can achieve high quantum efficiency. As these sensors are used in remote sensing applications, device
robustness and radiation tolerance was required.
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