Proc. SPIE. 5992, 25th Annual BACUS Symposium on Photomask Technology
KEYWORDS: Manufacturing, Optical proximity correction, Analog electronics, Optimization (mathematics), Photomask technology, System on a chip, Resolution enhancement technologies, Ranging, Chemical mechanical planarization
Filling for the prevention of CMP dishing and resolution enhancement technologies (OPC, PSM) can cause the size of IC designs represented in the popular GDSII Stream format to balloon by a factor of ten or more, resulting file sizes of tens of gigabytes and longer throughput times for the tools that must subsequently process the files. We describe the effects of optimizing GDSII Stream files on the tape-out flow. GDSII Stream file sizes can be reduced by as much as 95% (20X reduction) and subsequent tool throughput improved by factors of up to five (5X runtime improvement).