David R. Hetzer
Process R&D Manager at TEL Technology Ctr America
Area of Expertise:
Lithography , Scatterometry , Patterning , Defectivity
Publications (41)

Proceedings Article | 6 April 2020
Proc. SPIE. 11323, Extreme Ultraviolet (EUV) Lithography XI
KEYWORDS: Amorphous silicon, Lithography, Optical lithography, Etching, Scanning electron microscopy, Extreme ultraviolet, Extreme ultraviolet lithography, Critical dimension metrology, Line edge roughness, Oxidation

Proceedings Article | 26 March 2019
Proc. SPIE. 10957, Extreme Ultraviolet (EUV) Lithography X
KEYWORDS: Optical lithography, Particles, Coating, Inspection, Bridges, Extreme ultraviolet, Extreme ultraviolet lithography, Photoresist processing, Semiconducting wafers

Proceedings Article | 26 March 2019
Proc. SPIE. 10958, Novel Patterning Technologies for Semiconductors, MEMS/NEMS, and MOEMS 2019
KEYWORDS: Lithography, Optical lithography, Etching, Metals, Directed self assembly, Critical dimension metrology, Overlay metrology, Back end of line

Proceedings Article | 19 October 2018
Proc. SPIE. 10809, International Conference on Extreme Ultraviolet Lithography 2018
KEYWORDS: Optical lithography, Coating, Manufacturing, Extreme ultraviolet, Extreme ultraviolet lithography

SPIE Journal Paper | 5 September 2018
JM3 Vol. 18 Issue 01
KEYWORDS: Inspection, Semiconducting wafers, Stochastic processes, Extreme ultraviolet, Etching, Defect detection, Electron beam lithography, Modulation, Coating, Extreme ultraviolet lithography

Showing 5 of 41 publications
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