David Laidler
Researcher Advanced Lithography at IMEC
SPIE Involvement:
Author
Publications (35)

PROCEEDINGS ARTICLE | March 28, 2017
Proc. SPIE. 10145, Metrology, Inspection, and Process Control for Microlithography XXXI
KEYWORDS: Thin films, Metrology, Scanners, Distortion, Silicon films, Process control, Semiconductor manufacturing, Forward error correction, Semiconducting wafers, Overlay metrology, Lithographic metrology, Lithographic process control

PROCEEDINGS ARTICLE | March 28, 2016
Proc. SPIE. 9779, Advances in Patterning Materials and Processes XXXIII
KEYWORDS: Wafer-level optics, Optical lithography, Etching, Image processing, Scanners, Photomasks, Directed self assembly, Optical alignment, Semiconducting wafers

PROCEEDINGS ARTICLE | April 12, 2013
Proc. SPIE. 8683, Optical Microlithography XXVI
KEYWORDS: Optical lithography, Etching, Metals, Scanners, Copper, Double patterning technology, Optical alignment, Neodymium, Chemical mechanical planarization, Back end of line

PROCEEDINGS ARTICLE | April 1, 2013
Proc. SPIE. 8679, Extreme Ultraviolet (EUV) Lithography IV
KEYWORDS: Reticles, Optical lithography, Etching, Manufacturing, Extreme ultraviolet, Line width roughness, Extreme ultraviolet lithography, Critical dimension metrology, Semiconducting wafers, Overlay metrology

PROCEEDINGS ARTICLE | April 4, 2012
Proc. SPIE. 8324, Metrology, Inspection, and Process Control for Microlithography XXVI
KEYWORDS: Diffraction, Optical design, Reticles, Metrology, Etching, Scanners, Silicon, Neodymium, Semiconducting wafers, Overlay metrology

PROCEEDINGS ARTICLE | March 14, 2012
Proc. SPIE. 8322, Extreme Ultraviolet (EUV) Lithography III
KEYWORDS: Reticles, Scanners, Silicon, Manufacturing, Extreme ultraviolet, Extreme ultraviolet lithography, Optical alignment, Critical dimension metrology, Semiconducting wafers, Overlay metrology

Showing 5 of 35 publications
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