PROCEEDINGS ARTICLE | January 16, 2003
Proc. SPIE. 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II
KEYWORDS: Packaging, Polishing, Metals, Glasses, Annealing, Diffusion, Manufacturing, Reliability, Microopto electromechanical systems, Temperature metrology
Hermetic packaging of micro-optoelectromechanical systems (MOEMS) is an immature technology, lacking industry-consensus methods and standards. Off-the-shelf, catalog window assemblies are not yet available. Window assemblies are in general custom designed and manufactured for each new product, resulting in longer than acceptable cycle times, high procurement costs and questionable reliability.
There are currently two dominant window-manufacturing methods wherein a metal frame is attached to glass, as well as a third, less-used method. The first method creates a glass-to-metal seal by heating the glass above its Tg to fuse it to the frame. The second method involves first metallizing the glass where it is to be attached to the frame, and then soldering the glass to the frame. The third method employs solder-glass to bond the glass to the frame.
A novel alternative with superior features compared to the three previously described window-manufacturing methods is proposed. The new approach lends itself to a plurality of glass-to-metal attachment techniques. Benefits include lower temperature processing than two of the current methods and potentially more cost-effective manufacturing than all three of today’s attachment methods.
