David Tumpold
at Technische Univ Wien
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Publications (1)

PROCEEDINGS ARTICLE | May 17, 2013
Proc. SPIE. 8763, Smart Sensors, Actuators, and MEMS VI
KEYWORDS: Microelectromechanical systems, Electrodes, Computer simulations, 3D modeling, Scanning probe lithography, Capacitance, Finite element methods, CMOS technology, Chemical elements, Acoustics

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