In this paper we present thermal analysis of three different-structured high power LEDs. The thermal resistance of
different-structured LEDs was determined. The results indicated that the thermal resistance severely depended on the
number of bumps for flip-chip LEDs. One could get lower thermal resistance for flip-chip LEDs than that for
conventional and vertical LEDs by selecting appropriate number of bumps in theory. But considering the practical
process of LEDs' fabrication, the conventional LEDs because of the simple making process showed more stable and
lower thermal resistance. There existed the same problems as flip-chip LEDs' for vertical LEDs. Maybe electroplate
copper was the effective way to get good thermal characteristic.