Prof. Dennis Michael Sylvester
Assistant Professor at Univ of Michigan
SPIE Involvement:
Conference Program Committee | Author
Publications (12)

PROCEEDINGS ARTICLE | April 5, 2012
Proc. SPIE. 8347, Nondestructive Characterization for Composite Materials, Aerospace Engineering, Civil Infrastructure, and Homeland Security 2012
KEYWORDS: Transmitters, Thin films, Digital signal processing, Solar energy, Clocks, Capacitors, Sensors, Solar cells, Amplifiers, Temperature sensors

PROCEEDINGS ARTICLE | May 5, 2010
Proc. SPIE. 7679, Micro- and Nanotechnology Sensors, Systems, and Applications II
KEYWORDS: Energy efficiency, Switches, Clocks, Switching, Surgery, Sensors, Transistors, Chemical elements, Analog electronics, Failure analysis

PROCEEDINGS ARTICLE | April 9, 2010
Proc. SPIE. 7649, Nondestructive Characterization for Composite Materials, Aerospace Engineering, Civil Infrastructure, and Homeland Security 2010
KEYWORDS: Sensors, Inspection, Data processing, Telecommunications, Structural health monitoring, Bridges, Wireless communications, Data communications, Prototyping, Amplitude modulation

PROCEEDINGS ARTICLE | April 8, 2009
Proc. SPIE. 7294, Nondestructive Characterization for Composite Materials, Aerospace Engineering, Civil Infrastructure, and Homeland Security 2009
KEYWORDS: Internet, Data modeling, Sensors, Inspection, Data processing, Structural health monitoring, Finite element methods, Bridges, Sensing systems, Antennas

PROCEEDINGS ARTICLE | April 1, 2008
Proc. SPIE. 6925, Design for Manufacturability through Design-Process Integration II
KEYWORDS: Mathematical modeling, Oxides, Ions, Diffusion, Manufacturing, Capacitance, Transistors, Optimization (mathematics), TCAD, Standards development

SPIE Journal Paper | July 1, 2007
JM3 Vol. 6 Issue 03
KEYWORDS: Optical proximity correction, Tolerancing, Photomasks, Critical dimension metrology, Resolution enhancement technologies, Model-based design, Lithography, Computer programming, Capacitance, Semiconductors

Showing 5 of 12 publications
Conference Committee Involvement (4)
Design for Manufacturability through Design-Process Integration II
28 February 2008 | San Jose, California, United States
Design for Manufacturability through Design-Process Integration
1 March 2007 | San Jose, California, United States
Design and Process Integration for Microelectronic Manufacturing IV
23 February 2006 | San Jose, California, United States
Design and Process Integration for Microelectronic Manufacturing IV
3 March 2005 | San Jose, California, United States
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