Dr. Dirk Weiler
Head of Department at Fraunhofer-IMS
SPIE Involvement:
Author
Publications (7)

PROCEEDINGS ARTICLE | October 9, 2018
Proc. SPIE. 10795, Electro-Optical and Infrared Systems: Technology and Applications XV
KEYWORDS: Readout integrated circuits, Microbolometers, Thermography, Sensors, Black bodies, Infrared radiation, Semiconducting wafers, Temperature metrology

PROCEEDINGS ARTICLE | May 29, 2018
Proc. SPIE. 10624, Infrared Technology and Applications XLIV
KEYWORDS: Amorphous silicon, Readout integrated circuits, Microbolometers, Antireflective coatings, Sensors, Interfaces, Black bodies, Analog electronics, Semiconducting wafers, Temperature metrology

PROCEEDINGS ARTICLE | May 20, 2016
Proc. SPIE. 9819, Infrared Technology and Applications XLII
KEYWORDS: Readout integrated circuits, Microbolometers, Reflectors, Resistance, Optical resonators, Infrared radiation, Electro optics, Semiconducting wafers, Nanolithography, Absorption

PROCEEDINGS ARTICLE | June 24, 2014
Proc. SPIE. 9070, Infrared Technology and Applications XL
KEYWORDS: Amorphous silicon, Bolometers, Packaging, Readout integrated circuits, Microbolometers, Thermography, Sensors, Electro optics, Semiconducting wafers, Absorption

PROCEEDINGS ARTICLE | May 21, 2011
Proc. SPIE. 8012, Infrared Technology and Applications XXXVII
KEYWORDS: Amorphous silicon, Packaging, Readout integrated circuits, Microbolometers, Thermography, Ceramics, Resistance, Analog electronics, Electro optics, Semiconducting wafers

PROCEEDINGS ARTICLE | October 28, 2010
Proc. SPIE. 7834, Electro-Optical and Infrared Systems: Technology and Applications VII
KEYWORDS: Bolometers, Packaging, Infrared bolometers, Sensors, Reflectivity, Infrared radiation, Plating, Semiconducting wafers, Wafer bonding, Tin

Showing 5 of 7 publications
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