Proc. SPIE. 10962, Design-Process-Technology Co-optimization for Manufacturability XIII
KEYWORDS: Transceivers, Extremely high frequency, Metals, Manufacturing, Design for manufacturing, Analog electronics, Digital electronics, Yield improvement, Chemical mechanical planarization, Design for manufacturability
A suite of DFM enablement is enhanced to address the unique needs of analog, RF, and mmWave designs in the custom design flow. The DFM rules and patterns are made stricter beyond baseline requirements, and new DFM rules and patterns are added to further reduce layout-dependent device variability. Auto-fixing in the custom design flow is enhanced to meet these new requirements. New DFM enablement is developed for device matching for differential circuits and sensitive devices. Lastly, novel DFM fill strategies are implemented to reduce the variability of passive devices operating at high frequencies. Using DFM-aware fill, a 2% quality-factor loss for a mmWave inductor operating at 30 GHz is shown to be sufficient for meeting manufacturing planarity requirements.