Dong-Ik Shin
at SAMSUNG Electro-Mechanics Co Ltd
SPIE Involvement:
Author
Publications (1)

Proceedings Article | 6 February 2006
Proc. SPIE. 6068, Sensors, Cameras, and Systems for Scientific/Industrial Applications VII
KEYWORDS: Packaging, Cameras, Polymers, Metals, Glasses, Ultraviolet radiation, Lens design, Aspheric lenses, Semiconducting wafers, Wafer bonding

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