Mr. Dong Hou
GS Product Line Manager at Focuslight Technologies Inc
SPIE Involvement:
Author
Publications (8)

PROCEEDINGS ARTICLE | February 20, 2018
Proc. SPIE. 10513, Components and Packaging for Laser Systems IV
KEYWORDS: High power lasers, Crystals, Laser development, Resistance, Nd:YAG lasers, Solid state lasers, Semiconductor lasers, Heatsinks, Temperature metrology, Absorption

PROCEEDINGS ARTICLE | April 22, 2016
Proc. SPIE. 9730, Components and Packaging for Laser Systems II
KEYWORDS: Packaging, High power lasers, Copper, Reliability, Semiconductor lasers, Near field, High power diode lasers, Laser bonding, Laser systems engineering

PROCEEDINGS ARTICLE | April 22, 2016
Proc. SPIE. 9730, Components and Packaging for Laser Systems II
KEYWORDS: Gold, High power lasers, Indium, Reliability, Laser development, Resistance, Numerical simulations, Semiconductor lasers, High power diode lasers

PROCEEDINGS ARTICLE | February 20, 2015
Proc. SPIE. 9346, Components and Packaging for Laser Systems
KEYWORDS: Packaging, Indium, Reliability, Laser applications, Laser welding, Semiconductor lasers, High power diode lasers, Heatsinks, Laser bonding, Liquids

PROCEEDINGS ARTICLE | February 20, 2015
Proc. SPIE. 9346, Components and Packaging for Laser Systems
KEYWORDS: Packaging, High power lasers, Indium, Reliability, Laser development, Numerical simulations, Semiconductor lasers, High power diode lasers, Heatsinks, Pulsed laser operation

PROCEEDINGS ARTICLE | February 20, 2015
Proc. SPIE. 9346, Components and Packaging for Laser Systems
KEYWORDS: Packaging, Copper, Interfaces, Reliability, Laser development, Numerical simulations, Semiconductor lasers, Thermal effects, Finite element methods, High power diode lasers

Showing 5 of 8 publications
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