As the demands for the higher data transmission capacity and speed as well as higher integration density grow
throughout the network, much works have being done in order to integrate the Electrical PCB with Optical PCB.
In this paper, among the key technologies to integrate the Electrical PCB with Optical, the technology for getting the
via interconnection line with low resistivity using pulse mode electroplating method and bonding technology for high
bonding strength with low temperature process are studied.
As a result of this study, the measured value of electrical resistivity shows with a range from 20 to 26 mΩ and the
PCB bonding technology with high bonding strength is demonstrated with the value of bonding strength from 7 to 8
MPa.
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