New surface mount optical coupling solutions for short reach and chip level connection are presented. These
miniaturized optical interconnects have advanced micro-optics integrated within fiber connectors, chips and light
sources. Interconnect fabrication is compatible with Si CMOS processing, III-V processing and automated surface
mount assembly processing. The combination of these fabrication and assembly processing methods enable dramatic
cost reductions for optical interconnects.
Methods of coupling optical fiber and light sources to monolithic integrated photonic circuits are needed to expand
future photonics communications markets. Requirements are low cost, high coupling efficiencies, and scalability to high
volume production rates. Key features of the different optical coupling options will be discussed along with
implementation examples. Requirements for low cost optical coupling and high volume production scalability will be
Optical interconnects to couple light from single mode fiber to waveguides and photonic elements have remained
expensive due to tight alignment tolerances, materials choices, fabrication methods and assembly processing techniques.
Methods that have been used to lower the cost of optical interconnects will be reviewed and compared to current and
future market application demands. Design approaches, fabrication methodologies, and assembly processing techniques
for optical interconnects to meet future lower cost market application demands will be shared.