Prof. Enakshi Bhattacharya
Professor at IIT Madras
SPIE Involvement:
Conference Program Committee | Author
Publications (14)

PROCEEDINGS ARTICLE | February 18, 2010
Proc. SPIE. 7594, MOEMS and Miniaturized Systems IX
KEYWORDS: Microelectromechanical systems, Oxides, Mirrors, Interferometers, Spectroscopy, Fourier transforms, Micromirrors, Photomasks, Semiconducting wafers, Wafer bonding

PROCEEDINGS ARTICLE | February 5, 2010
Proc. SPIE. 7592, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
KEYWORDS: Microelectromechanical systems, Sensors, Etching, Composites, Silicon, Coating, Reliability, Picosecond phenomena, Self-assembled monolayers, Electrochemical etching

PROCEEDINGS ARTICLE | February 5, 2010
Proc. SPIE. 7592, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
KEYWORDS: Packaging, Gold, Oxides, Sensors, Glasses, Dielectrics, Silicon, Biosensors, Semiconducting wafers, Adhesives

SPIE Journal Paper | July 1, 2009
JM3 Vol. 8 Issue 03
KEYWORDS: Resistors, Resistance, Oxides, Etching, Surface micromachining, Thin films, Reactive ion etching, Microelectronics, Wet etching, Profilometers

SPIE Journal Paper | July 1, 2009
JM3 Vol. 8 Issue 03
KEYWORDS: Composites, Sensors, Picosecond phenomena, Silicon, Humidity, Crystals, Semiconducting wafers, Microelectromechanical systems, Scanning electron microscopy, Metals

PROCEEDINGS ARTICLE | February 26, 2008
Proc. SPIE. 6882, Micromachining and Microfabrication Process Technology XIII
KEYWORDS: Microelectromechanical systems, Sensors, Metals, Crystals, Composites, Silicon, Scanning electron microscopy, Profilometers, Picosecond phenomena, Semiconducting wafers

Showing 5 of 14 publications
Conference Committee Involvement (6)
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X
24 January 2011 | San Francisco, California, United States
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
25 January 2010 | San Francisco, California, United States
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII
28 January 2009 | San Jose, California, United States
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII
21 January 2008 | San Jose, California, United States
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI
23 January 2007 | San Jose, California, United States
Showing 5 of 6 published special sections
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