We present an integrated beam scanning system without moving mechanical parts. The device based on the thermooptical effect. In combination with a silicon oxynitrid waveguide and a planar integrated lens we use thin film heaters for thermooptical deflection of a guided mode close to the edge of an integrated optical chip. This leads to a deflection at the collimation optic consisting of a planar lens. We show thermal simulation for the optimization of the heater position. The result of the thermal simulation is combined with BPM simulation to evaluate the change of the mode position during heating. First deflection measurements of the system are shown.
A microlens suitable for integration with photonic elements on the same substrate is presented. It is fabricated utilizing
planar standard technologies such as UV lithography, ICP-CVD and Deep Reactive Ion Etching. For reaching an optical
3D functionality with 2 D structuring methods a variation of the refractive index during the layer deposition process in
the vertical direction is used. For the horizontal direction, parallel to the substrate, the shape of etched side walls
determines the focus. This procedure allows the independent control of light propagation in two perpendicular directions
with planar technologies. To demonstrate the potential of the technology, optical elements for the collimation of fiber-based
light sources are presented.